There are an increasing number of emerging medical technologies (MedTech) which are having a significant effect on the medical equipment and medical device industries. The main principles that come into play when applying these new medical technologies are design for manufacturability, thinking ahead, thinking critically, and taking the lead.

To create disruptive technologies and products, companies must investigate new materials, processes, and equipment sets. A new technology called Glass Core Technology, which provides avenues for new electrical, electro-optical, microfluidic, and biomedical applications, is particularly promising. In this webinar, our featured speaker will explore several of these applications and why they are so game-changing for future biomedical device technologies.

Join this webinar to learn about:

  • Glass Core Technology and its applications in MedTech
  • How to solve MedTech product development issues using diverse approaches including, “secret sauces,” robust and reliable materials, engineering decision driven by data, and more
  • What needs to get developed in order to take the first big step in getting a MedTech product from concept to completion

Speaker

Steve Groothuis, Chief Technology Officer, Samtec Microelectronics

Mr. Steven Groothuis is the Chief Technology Officer at Samtec Microelectronics and maintains the package technology roadmaps for Samtec’s microelectronic packaging products. He is involved in leading edge IC, MEMS, sensor, and optical/photonics package technology. He is a market strategist and technology advisor. He is involved in autonomous vehicles, biomedical, optical/photonics, and microelectronics sectors.

Prior to Samtec, he was a DMTS at Micron Technology providing advancements on the advanced Hybrid Memory Cube package technology development and path finding, and multiphysics simulations. Mr. Groothuis worked at ANSYS as a Multiphysics Industry Specialist on MEMS simulation initiatives. He started his career as a package technologist at Texas Instruments and later became the Advanced Semiconductor Packaging Lab Manager.

Mr. Groothuis received his BS Physics from Michigan State University and MS Physics from the University of Texas at Dallas. He has coauthored over 50 technical papers, holds over 17 US patents, and is a Senior Member of the Institute of Electrical and Electronics Engineers (IEEE).

Message Presenter

Who Should Attend?

  • Biomedical engineers, scientists, test engineers, sensor packaging engineers, and industry consultants who are involved in R&D, design, materials selection, product manufacturing, and testing of biomedical devices and products
  • Individuals involved in nanotechnology, implantable devices, medical diagnostic equipment, medical imaging, in vitro diagnostic (IVD) devices, and mobile health
  • Those with associated job functions, including medical venture capitalists, mobile health specialists, and intellectual property engineers

What You Will Learn

 Join this webinar to learn about:

  • Glass Core Technology and its applications in MedTech
  • How to solve MedTech product development issues using diverse approaches, including “secret sauces,” robust and reliable materials, engineering decision driven by data, and more
  • What needs to get developed in order to take the first big step in getting a MedTech product from concept to completion

Xtalks Partner

Samtec

Known as the worldwide service leader for electronic connectors and cables, Samtec has focused on leading edge high speed products and services for the last two decades. The tremendous success in these areas has driven Samtec to further move into faster and smaller arenas. They now provide full turnkey solutions for your entire signal chain from Integrated Circuits, MEMS, and sensors, through the package, and through substrates, connectors and cables. Samtec Microelectronics can help you design, model, layout, and assemble your biomedical device packages. Our core capabilities include:

  • Advanced package substrate design,
  • Flip chip, die attach, wire bonding, dam, encapsulation, transfer molding, and lid attach,
  • Modeling and prototyping,
  • Electrical testing and debug,
  • In-house mid-board optical/photonic engine design, manufacturing, and packaging,
  • New capabilities in glass interposers and substrates with low loss electrical characteristics, biomedical microstructuring, flow cell interfacing, and 2.5D package integration.

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