Building Smart Biomedical Devices Using Glass, Lasers, Sensors, and Chips

Medical Device Design, Medical Device Manufacturing & Supply Chain,
  • November 03, 2017

Samtec provides innovative solutions for interconnecting chips, packages, modules, and systems throughout the electronics industry.  In order to address such a large range of applications, Samtec’s focus is on innovation.  Our marketing tagline is “Integration = Innovation”.  It shows in each current and future product Samtec makes.

As a part of Samtec’s Technology Centers, Samtec Microelectronics has provided device packaging services for medical devices and medical diagnostic equipment over the past 20 years.

To create disruptive technologies and products, companies must investigate new materials, processes, and equipment sets. Samtec has invested heavily in a new technology called Glass Core Technology (GCT), which provides avenues for new electrical, electro-optical, microfluidic, and biomedical applications.  We will explore several of these applications and why they are so game changing for future biomedical device technologies.

This webinar will explain where Glass Core Technology will lead out customers to new products with a higher level of integration and more innovative features that result in smart biomedical devices and other emerging technologies.

Speakers

Steve Groothuis, Chief Technology Officer, Samtec Microelectronics

 

Mr. Steven Groothuis is the Chief Technology Officer at Samtec Microelectronics and maintains the package technology roadmaps for Samtec’s microelectronic packaging products. He is involved in leading edge IC, MEMS, sensor, and optical/photonics package technology.  He is a market strategist and technology advisor.  He is involved in autonomous vehicles, biomedical, optical/photonics, and microelectronics sectors.

Prior to joining Samtec, he was a DMTS at Micron Technology providing advancements on the advanced Hybrid Memory Cube package technology development and path finding, and multiphysics simulations. Mr. Groothuis worked at ANSYS as a Multiphysics Industry Specialist on MEMS simulation initiatives. He started his career as a package technologist at Texas Instruments and later became the Advanced Semiconductor Packaging Lab Manager.

Mr. Groothuis received his BS Physics from Michigan State University and MS Physics from the University of Texas at Dallas. He has coauthored over 50 technical papers, holds over 17 US patents, and is a Senior Member, IEEE.

Who Should Attend?

  • Biomedical engineers, scientists, test engineers, sensor packaging engineers, and industry consultants who is involved in R&D, design, materials selection, product manufacturing, and testing of biomedical devices and products.
  • Individuals involved in nanotechnology, implantable devices, medical diagnostic equipment, medical imaging, in vitro diagnostic (IVD) devices, and mobile health will discover the value of attending this presentation.
  • Associated job functions that have found this presentation informative are medical venture capitalists, mobile health specialists, and intellectual property engineers.

Xtalks Partners

Samtec

Known as the worldwide service leader for electronic connectors and cables, Samtec has focused on leading edge high speed products and services for the last two decades. The tremendous success in these areas has driven Samtec to further move into faster and smaller arenas. They now provide full turnkey solutions for your entire signal chain from Integrated Circuits, MEMS, and sensors, through the package, and through substrates, connectors and cables. Samtec Microelectronics can help you design, model, layout, and assemble your biomedical device packages.  Our core capabilities include:

o    Advanced Semiconductor, MEMS, and Sensor substrate design,

o    Flip chip, die attach, wire bonding, dam, encapsulation, transfer molding, and lid attach,

o    Modeling and prototyping,

o    Electrical testing and debug,

o    In-house mid-board optical/photonic engine design, manufacturing, and packaging, and

o    New capabilities in glass interposers and substrates with low loss electrical characteristics, biomedical microstructuring, and 2.5D package integration.

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